F & K Delvotec Wire Bonders
Model M17S
Model M17S
Model M17S
Automatic, Programmable Wire Bonding
Single Head System
Base Machine Accepts Interchangeable Bond Heads for:
- Wedge - Fine Wire
- Wedge Heavy Wire & Ribbon
- Ball Bonding
- Deep AccessI
- Multi-Level Surfaces
Model M17D
Model M17S
Model M17S
Automatic, Programmable Wire Bonding
Dual Head System
Performs Two Bonding Processes Concurrently
Base Machine Accepts Interchangeable Bond Heads for:
- Wedge - Fine Wire
- Wedge Heavy Wire & Ribbon
- Ball Bonding
- Deep AccessI
- Multi-Level Surfaces
Model M17L
Model M17S
Model M17XL
Automatic Programmable Wire Bonding
Single Head System
Large Area
Single or Dual Manual Work Holders
Single or Dual Track Indexer with Bond-off Station
All Bonding Technologies Available
Model M17XL
BPC - Bond Process Control
Model M17XL
Automatic, Programmable Wire Bonding
Single Head System
Very Large Area:
1.130mm x 700mm (44.5" x 27.5")
All Bonding Technologies Available
Ultrasonic Laser Bonding
BPC - Bond Process Control
BPC - Bond Process Control
More Robust Than Conventional Wire Bonding
Based on Micro-Welding Technology
Greatly Reduces Process Issues Due to Contamination and/or Vibration
BPC - Bond Process Control
BPC - Bond Process Control
BPC - Bond Process Control
Real Time Monitoring and Analysis of Bond Process
Automatic Feedback To Control System with Visual and Audible Alarms
SPC Data Collection and Trending
For Root Cause Analysis of Materials, Process and Machine